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  • Anti condensation sealing material - self leveling

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    Product Description

    This product is a solvent-free, low viscosity, room temperature curing, flame-retardant two-component polyurethane sealant. It has excellent electrical insulation, high oxygen index, resistance to cold and hot shocks, excellent weather resistance, and can cure at room temperature.

    Scope of application

    This product can be used for electronic component encapsulation, such as cable joint encapsulation, ignition coils, etc.

    Technical specification

    Main reagent A

    Curing agent B

    colour

    Beige color

    Light brown

    Density (g/cm ³, 25 ° C)

    1.36±0.05   

    1.24±0.05&nbsp

    Viscosity(mPa.s, 25℃)

    7000±1000   

    7000±1000   

    Mixing ratio (by weight)

     100

     100

    After mixing (main reagent + curing agent)
    Density (g/cm ³, 25 ° C) 1.30 ±0.05
    Viscosity (mPa.s, 25℃) 5000±500
    Gel time (132g, 60℃) 30-40 minutes

    Recommended process

    1. Preheating: Please dry the poured components at 60 ℃ for 1-2 hours to remove moisture from the electronic components.

    2.Anti-condensation sealing material storage time is too long, there will be a little precipitation, please stir evenly before use.

    1. Mixing: Weigh A and B in proportion, and stir at a constant speed in the same direction for about 2 minutes. Try to avoid introducing air during the mixing process. Pay attention to the bottom and edges of the container and stir evenly to avoid defects after pouring and curing.

    4.If higher surface smoothness is required for the device, vacuum should be applied while stirring the device, and the vacuum degree (-0.09Mpa~-0.1Mpa) can smoothly remove bubbles.

    1. Pouring: Pour the mixture into the device, paying attention to the pouring speed not being too fast, and pouring it tightly against the edge of the electronic device can reduce the bubbles generated by pouring.
    2. Gel: 25 ℃/24h or 60 ℃/25min. Due to the sensitivity of this product to moisture, which can cause solidification bubbles, it is recommended to control the operating environment at 25 ± 5 ℃ and relative humidity<70%.

    Performance after curing(25℃/24h X 5)

    Item

    Unit or condition

      699-3 A/B

    Hardness

    Shore A

    70±10

    Dielectric constant

    [F/m]

    >3.0

    Dielectric loss

    -

    <0.10

    Volume resistivity

    [Ωcm]

          ≥1.0×10^11

    Disruptive strength

    [kV/mm]

    >15

    Tensile strength

    [N/mm2]

    ≥1

    Elongation

    %

    ≥25

    Flame retardant performance

    UL94

    V-0

    Oxygen index

    %

    ≥32

    Storage, transportation and precautions:

    1. Store at room temperature (25 ± 5 ℃), constant humidity (45~85% RH), in a dark and sealed place away from light.
    2. Please use the corresponding product model and weigh accurately.
    3. This type of product belongs to non hazardous materials and is stored and transported as a general chemical. The storage period of the product can be found in the packaging drum.
    4. This result is obtained from laboratory standard spline testing, and the customer needs to verify its adaptability in application.

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